LatticeAx Cleaving Solutions: 10-um Accuracy in < 5-min 


A New Way of Cleaving

  • Precision mechanics integrated with high resolution optics and independently controlled sample and indenter stages
  • LatticeAx indents. A shallow indent is made on the surface of the sample. No scribing
  • Clean and accurate cleaves in <5 minutes. No Dust, just a straight, long cleave with a mirror finish

NEW & EFFICIENT sample preparation workflow

The LatticeAx is more accurate than manual cleaving and less costly and faster than complex automated machines. It is synergistic with other tools in the lab changing the sample preparation workflow and reduces the time to prepare cross sections. 

Recent News: New LatticeAx 300 Installations in Germany and Oregon ▶


 

LatticeAx 110

Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2-min.


 

LatticeAx 220

The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm cleaving accuracy.within 5-min


 

LatticeAx 300

LatticeAx300 is LatticeGear’s highest performance cleaving solution. It integrates vision package with 5-μm optical resolution and precise control of all axis to cleave with 10-um accuracy in <5-min.


Rotated Lithography  

Cleaving structures printed at 45 degrees

The LatticeAx was used to cleave a specific site on the sample without the luxury of features that are aligned perpendicular to the sample’s leading edge. Although the silicon is <100> the pattern shown is rotated 45 degrees. This makes it more challenging to target features. A process was developed to target the area of interest and cleave.

LatticeAx Results

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Cross sections of photoresist are critical in understanding a lithographic process. The LatticeAx was used to cleanly cleave photoresist. The sample was cleaved and then coated with a conductive film and examined in an SEM.

1. Site Specific RESIST cross-sectioning in 2-min

Cross sections of photoresist are critical in understanding a lithographic process. The LatticeAx was used to cleanly cleave photoresist. The sample was cleaved and then coated with a conductive film and examined in an SEM.

A multi-tool process was used to prepare cross sections of copper bumps. The LatticeAx was used to cleave close to a specific row of copper bumps for quick, final broad argon ion beam milling.

2. Cleaving Accurately Flip Chip Copper Bumps

A multi-tool process was used to prepare cross sections of copper bumps. The LatticeAx was used to cleave close to a specific row of copper bumps for quick, final broad argon ion beam milling.

Cross section of SEMATECH 5x50 micron TSVs. A single tool (LatticeAx) process was used to simply cleave through the etched vias and the image in the SEM without any other preparation.

3. Site-Specific Cleaving of Etched TSVs

Cross section of SEMATECH 5x50 micron TSVs. A single tool (LatticeAx) process was used to simply cleave through the etched vias and the image in the SEM without any other preparation.

In 2-min, straight, clean, high quality cross-section surfaces.

4. As cleaved, Copper cross-section – Mirror Finish surface Quality

In 2-min, straight, clean, high quality cross-section surfaces.

What our customers are saying:

“…to see a very small target.  Before we would cleave just to safely get a piece for polishing.  Now we can confidently get much closer, polish times come way down…” 

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