14 Nov 2016

High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

27 Oct 2016

LatticeGear Receives Business Certifications

LatticeGear, LLC. has been certified! The following certifications were granted:

  • Emerging Small Business (ESB)
  • Women Business Enterprise (WBE)
  • Minority Business Enterprise (MBE)

LatticeGear’s certification ID is 10516. Thanks much to the State of Oregon and Marta Tarantsey for coaching us through the certification process. Please contact us for copies of the certification letters.

04 Oct 2016
20 Sep 2016
08 Sep 2016

LatticeAx used to prepare GaN m-plane end facets

Researchers at Yale University developed a novel conductivity based selective electrochemical etching  to introduce nanometer sized pores into GaN. The fabrication process for the edge-emitting laser cavity samples included cleaving with the LatticeAx 420, diamond-tipped cleaving tool to form the GaN m-plane end facets. See the paper in the Proc. of SPIE Vol. 9748 97480Q-7. For more information contact Ge Yuan, ge.yuan@yale.edu

31 Aug 2016

LatticeGear introduces the NEW LatticeAx 225

The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″).  The new design enables magnification and focus to be changed without mechanical adjustments to the microscopes working distance. The perfect, indent and cleaving system with microscope vision for downsizing wafers and a wide variety of samples for analysis or further processing. READ MORE

LatticeAx 225 right side view

09 Aug 2016

Cleaving Copper C4 Bumps

The LatticeAx was a key component of the sample preparation workflow for preparing copper C4 bumps for examination in the SEM. The results revealed the bump-metallization interface. The process was more cost effective and could be achieved much faster in comparison to using a focused ion beam (FIB) instrument. Read More

SEM image of bump-metallization interface

SEM image of bump-metallization interface

09 Aug 2016
27 Jun 2016

Cleaving Glass Slides

Cleaved glass slide

Cleaved glass slide

The glass slide above was cleaved with the LatticeAx 120. The LatticeAx produces clean edges without creating fractures. This method was used to prepare samples for further analysis using and AFM of samples mounted on the surface of the slide. 

This technique was used by researchers at Penn State to downsize a glass slide containing carefully prepared samples, after it was discovered that the slide was too tall for the analytical equipment into which it needed to be places. This saved the research teams days of extra labor to recreate samples on a new slide. Read More

 

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