16 Jun

Downsizing die to fit your Prober or SEM or FIB sample holder

Downsize die to fit your Prober, SEM or FIB sample holder without any “cracking” risk

Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the cleaving step was eliminated.  For thicker samples (or die on a host), a 2 step process, microline indent + 3-point cleave is used. These processes enable hard to prepare thin and thick back end samples to be prepared.

n-probe stub

Out-of-package samples prepared using the LatticeAx. Bottom right shows sample on n-prober stub.

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