31 Aug 2016

LatticeGear introduces the NEW LatticeAx 225

The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″).  The new design enables magnification and focus to be changed without mechanical adjustments to the microscopes working distance. The perfect, indent and cleaving system with microscope vision for downsizing wafers and a wide variety of samples for analysis or further processing. READ MORE

LatticeAx 225 right side view

09 Aug 2016

Cleaving Copper C4 Bumps

The LatticeAx was a key component of the sample preparation workflow for preparing copper C4 bumps for examination in the SEM. The results revealed the bump-metallization interface. The process was more cost effective and could be achieved much faster in comparison to using a focused ion beam (FIB) instrument. Read More

SEM image of bump-metallization interface

SEM image of bump-metallization interface

09 Aug 2016

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