High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates
At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.
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- The thin <100 micron die was cleanly downsized using the LatticeAx
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- Die out of the package cleanly cleaved with the LatticeAx
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- Thin die sample downsized by sawing prior to polishing shows fractured edges and contamination.
