18 Jul 2017

Attend “Cleaving and Scribing Reinvented” in Sydney Australia

LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”

How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is offered at no cost. RSVP to: info@nt-s.com.au

18 Jul 2017

Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation

Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.

Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.

Map showing LatticeAx 120 base features

LatticeAx indenter decapsulating the MEMS package.

 

 

 

 

 

 

 

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