18 Jul

Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation

Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.

Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.

Map showing LatticeAx 120 base features

LatticeAx indenter decapsulating the MEMS package.

 

 

 

 

 

 

 

 

 

 

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