Sapphire wafer after cleaving into small samples
IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018
Visit LatticeGear- Booth 86 (Nano Technology Solutions)
At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.
JSAP 2108, September 18-21, 2018, Nagoya Japan
Visit LatticeGear at Hisol booth
Fabricated Nanostructure after cleaving
Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.
DO NOT MISS, LatticeGear Luncheon Seminar: The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.
Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE