21 Sep 2018

Don’t Miss the Industrial Session at ESREF- LatticeGear to Present Scribing and Cleaving Solutions!

LatticeGear to Present at ESREF

Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.

See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23

LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here

Cleaved Wave guide-Quantum Photonics Group, Niels Bohr Institute

04 Sep 2018

Visit LatticeGear at JSAP 2018 September 18-21

Visit LatticeGear at Hisol booth

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber

DO NOT MISS, LatticeGear Luncheon Seminar

Scribeless cleaving method for glass, sapphire, III-V, SiC and silicon. Surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 – https://meeting.jsap.or.jp/english/luncheon-seminars

Cleaving sapphire with sample cleaving pliers

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