26 Apr 2018
28 Mar 2018

See Scribers and Cleavers in Action at MRS Phoenix, April 2-5

Attending the Materials Research Society (MRS) Spring meeting?

Need Clean Edges?

Cleaved Glass Slide

Don’t Forget Your Samples

Scribe and Cleave with LatticeGear!

 

Live Demos of the LatticeAx 420, scribeless cleaving machine,

and the FlipScribe, the world’s first tool that scribes without touching the sample surface.

See how it is done! Watch the video

4x3mm singulated die for photonics and cross section view.

 

Electron Microscopy Sciences Booth 205

SPI Supplies Booth 301

Questions?

Schedule a Demo

 

 

05 Mar 2018

Cleaving with LatticeGear Cleanbreak Pliers

When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur!

LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to;

  • decide which type of jaws to install (there are two types)
  • install the cleaving jaws,
  • cleave a sample (glass and silicon) and
  • remove and replace jaws when they are worn out

For  small samples (<15 mm) use LatticeGear’s small sample cleaving pliers

Download the information card here.

Bare sapphire wafer during cleaving with the Cleanbreak pliers

20 Feb 2018
06 Sep 2017

LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities

Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization.  This type of lecture is not part of any curriculum, yet fundamental for research and development.

It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material.  While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.

Please contact LatticeGear at lg@latticegear.com if you would like to schedule a seminar at your industrial or academic laboratory.

07 Aug 2017
18 Jul 2017

Attend “Cleaving and Scribing Reinvented” in Sydney Australia

LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”

How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is offered at no cost. RSVP to: info@nt-s.com.au

18 Jul 2017

Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation

Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.

Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.

Map showing LatticeAx 120 base features

LatticeAx indenter decapsulating the MEMS package.

 

 

 

 

 

 

 

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28 Jun 2017

LatticeGear LLC Announces New Representation in China

LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research

LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.

Beaverton, Oregon, USA June 27, 2017: LatticeGear LLC has selected Hong Kong Guangdong International Co., Ltd. (GHITC) to represent and distribute their innovative cleaving and scribing solutions in China. Hong Kong Guangdong International Co. Ltd. is LatticeGear’s fifth sale channel partner in Asia-Pacific, further reinforcing LatticeGear’s commitment to providing excellent and timely customer support to this region.

“We are very excited to introduce our new partner at IPFA 2017,” said Efrat Moyal, Co-Founder of LatticeGear. “Hong Kong Guangdong International Co., Ltd. has a very strong background in both semiconductor failure analysis and electron microscopy. Their ability to relate to customer challenges when it comes to preparing a variety of samples will be a great asset for not only identifying the best solutions for a particular use case, but also for helping customers improve their sample preparation success rates.”

“It is our pleasure to cooperate with LatticeGear to bring high quality, high accuracy, yet very easy to use cleaving and scribing systems to China,” states Michael Heng, Sales Director at Hong Kong Guangdong International Co. Ltd. “We expect that the LatticeGear systems will be in demand in China for sample preparation because they are cleanroom compatible, high accuracy and offer reproducibility for routine tasks, all at a price that is affordable for most customers.”

Visit LatticeGear in Stand 40 at IPFA 2017, 4-7 July 2017, in Chengdu, China, to meet the team from Hong Kong Guangdong International, and see the innovative LatticeAx® scribeless cleaving system and FlipScribe® backside scriber, among other LatticeGear solutions.

About LatticeGear LLC

LatticeGear was founded in 2012 by two women with extensive experience in the semiconductor industry who believed passionately that materials cleaving and scribing should be easy and fast.   LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® scribeless cleaving system and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom. Learn more at http://www.latticegear.com/.

About Hong Kong Guanghong International Co., Ltd. (GHITC)
GHITC provides sales and service for nanotechnology-related equipment, supporting both semiconductor failure analysis and materials research applications from their headquarters in Shanghai. Their team includes experts in electron microscopy, as well as in the semiconductor industry. Within China, learn more at www.ghitcsh.com.

Contact:

Efrat Moyal, LatticeGear LLC
efrat.moyal@latticegear.com

Michael Heng, Hong Kong Guanghong International Co., Ltd
hongkongguanghong@163.com

22 May 2017

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

“NanoTechnology Solutions’ expertise in microscopy and sample preparation makes them the ideal partner to support our customers in ANZ,” said Efrat Moyal, Co-Founder of LatticeGear. “We are confident that engineers and scientists who want to add LatticeGear high accuracy scribing and cleaving techniques to their lab will get the same expert advice as if they had come to us directly.”

LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® Scribeless Cleaving System and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom.

NanoTechnology Solutions specializes in supply and service of microscopy and sample preparation instruments across Australia and New Zealand. They have extensive experience in high resolution imaging techniques such as Electron Microscopy and Scanning Probe Microscopy for both materials science and biological samples. They put their strong knowledge to work with training and expert advice on sample preparation and imaging – even for complex materials and challenging applications – to help researchers achieve desired results in their projects.

Contact information:
NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 

 

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