04 Sep 2018

Visit LatticeGear at JSAP 2018 September 18-21

Visit LatticeGear at Hisol booth

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber

DO NOT MISS, LatticeGear Luncheon Seminar

Scribeless cleaving method for glass, sapphire, III-V, SiC and silicon. Surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 – https://meeting.jsap.or.jp/english/luncheon-seminars

Cleaving sapphire with sample cleaving pliers

30 Aug 2018
17 Aug 2018

See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19

Sapphire wafer after cleaving into small samples

IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Fabricated Nanostructure after cleaving

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

07 Aug 2018
07 Aug 2018
12 Jul 2018
27 Jun 2018

Dry, Particle-Free Wafer Downsizing in the Cleanroom

Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper.

First you may ask “Why implement a cleaving process in the cleanroom?”:

Here is what the Operations Director of a National Nanofabrication Facility had to say,

“Here at our nanofabrication facility, we found that after installing the micro-indent [LatticeAx 420] in our cleanroom, users are no longer cleaving samples in the lithography area. Additionally, the “cleaner” cleaving process of the micro-indent creates very few shards and particles that are easily vacuumed. Users are motivated by the capabilities of the LatticeAx and rewarded with a cleaner process. It’s a win-win scenario”

LatticeGear presents a process and data showing how the LatticeAx 420 scribeless cleaving system was used to cleanly cleave wafers. To obtain statistics, 60 samples were cleaved out of 10 whole, 4” silicon wafers. The results showed no increase in particle count.

Particle count comparison for 0.3 micron size, before and after wafer cleaving, points 1-3.

LatticeGear wishes to thank the University of Sydney (Ethel Cabrera Ilagan) and Penn State University for their assistance with this study.

Contact LatticeGear at lg@latticegear.com to get a copy of the paper.

26 Apr 2018
05 Mar 2018

Cleaving with LatticeGear Cleanbreak Pliers

When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur!

LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to;

  • decide which type of jaws to install (there are two types)
  • install the cleaving jaws,
  • cleave a sample (glass and silicon) and
  • remove and replace jaws when they are worn out

For  small samples (<15 mm) use LatticeGear’s small sample cleaving pliers

Download the information card here.

Bare sapphire wafer during cleaving with the Cleanbreak pliers

20 Feb 2018

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