04 Apr 2017

Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures

Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research to investigate the quantum interactions between light and nanophotonic semiconductor materials. They needed a way to cleave small sample without damaging the delicate devices. Cleaving using hand held scribers and cleaving tools did not produce the quality needed but the LatticeAx 420 cleaving system was able to do the job.

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14 Feb 2017

LatticeAx Cleaving Tool In the Cleanroom at PennState Materials Research Institute

Did you know that you can use the LatticeAx indent and cleaving tool at the PennState Materials Research Institute? The LatticeAx 420 is located in the Nanofabrication Laboratory cleanroom. It has improved the success rates for preparing cleaved samples in comparison to manual techniques using handheld tools. The LatticeAx is simple to use and can cleanly downsize samples or prepare cross sections prior to SEM or other analysis. If you need to prepare samples free of particles in a cleanroom environment, Contact the nanofabrication facility at nanofab@psu.edu.

02 Feb 2017

Scribing and Cleaving Samples Into 1 mm Wide Strips

Some analytical instruments can only accept small samples and with limited height. Sample preparation by scribing and cleaving is often the best solution. LatticeGear’s scribing and cleaving tools are used to prepare narrow samples for high resolution SEM and STEM. The video shows two methods of preparing 1 mm wide strips. One narrow sample was prepared by making a short scribe using a pen style scriber on the edge of the sample and cleaving with Small Sample Pliers . The second example was scribed using the FlipScribe® and cleaved using the Small Sample Pliers. The FlipScribe® creates a straight scribe on the backside of the sample. This is the preferred method when the sample surface needs to be clean, free of particles and damage from the scribing process.

09 Jan 2017

LatticeGear Introduces Small Sample Cleaving Pliers

Have you had trouble cleaving small samples? LatticeGear introduces our Small Sample Cleaving Pliers and Scribing and Cleaving Kit for Small Samples. The custom handheld cleaving pliers can cleave samples into pieces from 1 – 30 mm with soft nylon covered jaws that do not damage your sample. These new accessories can be purchased on the eStore.

Sample cleaved with small sample cleaving pliers

Sample cleaved with small sample cleaving pliers

GC-SSKIT-200 Scribing and Cleaving Kit for Small Samples

GC-SSKIT-200 Scribing and Cleaving Kit for Small Samples

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Small Sample Cleaving Pliers

 

14 Nov 2016

High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

27 Oct 2016

LatticeGear Receives Business Certifications

LatticeGear, LLC. has been certified! The following certifications were granted:

  • Emerging Small Business (ESB)
  • Women Business Enterprise (WBE)
  • Minority Business Enterprise (MBE)

LatticeGear’s certification ID is 10516. Thanks much to the State of Oregon and Marta Tarantsey for coaching us through the certification process. Please contact us for copies of the certification letters.

04 Oct 2016
20 Sep 2016
08 Sep 2016

LatticeAx used to prepare GaN m-plane end facets

Researchers at Yale University developed a novel conductivity based selective electrochemical etching  to introduce nanometer sized pores into GaN. The fabrication process for the edge-emitting laser cavity samples included cleaving with the LatticeAx 420, diamond-tipped cleaving tool to form the GaN m-plane end facets. See the paper in the Proc. of SPIE Vol. 9748 97480Q-7. For more information contact Ge Yuan, ge.yuan@yale.edu

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