06 Sep 2017

LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities

Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization.  This type of lecture is not part of any curriculum, yet fundamental for research and development.

It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material.  While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.

Please contact LatticeGear at lg@latticegear.com if you would like to schedule a seminar at your industrial or academic laboratory.

07 Aug 2017
18 Jul 2017

Attend “Cleaving and Scribing Reinvented” in Sydney Australia

LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”

How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is offered at no cost. RSVP to: info@nt-s.com.au

18 Jul 2017

Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation

Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.

Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.

Map showing LatticeAx 120 base features

LatticeAx indenter decapsulating the MEMS package.

 

 

 

 

 

 

 

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A Controlled Method for MEMS Decapsulation 2.83 MB 35 downloads

Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device....

 

 

 

22 May 2017

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

“NanoTechnology Solutions’ expertise in microscopy and sample preparation makes them the ideal partner to support our customers in ANZ,” said Efrat Moyal, Co-Founder of LatticeGear. “We are confident that engineers and scientists who want to add LatticeGear high accuracy scribing and cleaving techniques to their lab will get the same expert advice as if they had come to us directly.”

LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® Scribeless Cleaving System and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom.

NanoTechnology Solutions specializes in supply and service of microscopy and sample preparation instruments across Australia and New Zealand. They have extensive experience in high resolution imaging techniques such as Electron Microscopy and Scanning Probe Microscopy for both materials science and biological samples. They put their strong knowledge to work with training and expert advice on sample preparation and imaging – even for complex materials and challenging applications – to help researchers achieve desired results in their projects.

Contact information:
NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 

 

04 Apr 2017

Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures

Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research to investigate the quantum interactions between light and nanophotonic semiconductor materials. They needed a way to cleave small sample without damaging the delicate devices. Cleaving using hand held scribers and cleaving tools did not produce the quality needed but the LatticeAx 420 cleaving system was able to do the job.

More..

14 Feb 2017

LatticeAx Cleaving Tool In the Cleanroom at PennState Materials Research Institute

Did you know that you can use the LatticeAx indent and cleaving tool at the PennState Materials Research Institute? The LatticeAx 420 is located in the Nanofabrication Laboratory cleanroom. It has improved the success rates for preparing cleaved samples in comparison to manual techniques using handheld tools. The LatticeAx is simple to use and can cleanly downsize samples or prepare cross sections prior to SEM or other analysis. If you need to prepare samples free of particles in a cleanroom environment, Contact the nanofabrication facility at nanofab@psu.edu.

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

04 Oct 2016
08 Sep 2016

LatticeAx used to prepare GaN m-plane end facets

Researchers at Yale University developed a novel conductivity based selective electrochemical etching  to introduce nanometer sized pores into GaN. The fabrication process for the edge-emitting laser cavity samples included cleaving with the LatticeAx 420, diamond-tipped cleaving tool to form the GaN m-plane end facets. See the paper in the Proc. of SPIE Vol. 9748 97480Q-7. For more information contact Ge Yuan, ge.yuan@yale.edu

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