22 Oct 2018

Are You Ready For ISTFA?

LatticeGear has you covered from all sides!

Booth 220, Phoenix Convention Center October 30-31

Sign up for Tools of the Trade to get a Preview of our new products including the

NEW FlexScribe topside scriber, it’s a MUST SEE (Monday October 29- 5-6pm)

The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and LatticeAx® scribing and cleaving solutions.

The FlexScribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.

 

17 Aug 2018

See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19

Sapphire wafer after cleaving into small samples

IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Fabricated Nanostructure after cleaving

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

06 Sep 2017

LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities

Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization.  This type of lecture is not part of any curriculum, yet fundamental for research and development.

It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material.  While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.

Please contact LatticeGear at lg@latticegear.com if you would like to schedule a seminar at your industrial or academic laboratory.

07 Aug 2017
28 Jun 2017

LatticeGear LLC Announces New Representation in China

LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research

LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.

Beaverton, Oregon, USA June 27, 2017: LatticeGear LLC has selected Hong Kong Guangdong International Co., Ltd. (GHITC) to represent and distribute their innovative cleaving and scribing solutions in China. Hong Kong Guangdong International Co. Ltd. is LatticeGear’s fifth sale channel partner in Asia-Pacific, further reinforcing LatticeGear’s commitment to providing excellent and timely customer support to this region.

“We are very excited to introduce our new partner at IPFA 2017,” said Efrat Moyal, Co-Founder of LatticeGear. “Hong Kong Guangdong International Co., Ltd. has a very strong background in both semiconductor failure analysis and electron microscopy. Their ability to relate to customer challenges when it comes to preparing a variety of samples will be a great asset for not only identifying the best solutions for a particular use case, but also for helping customers improve their sample preparation success rates.”

“It is our pleasure to cooperate with LatticeGear to bring high quality, high accuracy, yet very easy to use cleaving and scribing systems to China,” states Michael Heng, Sales Director at Hong Kong Guangdong International Co. Ltd. “We expect that the LatticeGear systems will be in demand in China for sample preparation because they are cleanroom compatible, high accuracy and offer reproducibility for routine tasks, all at a price that is affordable for most customers.”

Visit LatticeGear in Stand 40 at IPFA 2017, 4-7 July 2017, in Chengdu, China, to meet the team from Hong Kong Guangdong International, and see the innovative LatticeAx® scribeless cleaving system and FlipScribe® backside scriber, among other LatticeGear solutions.

About LatticeGear LLC

LatticeGear was founded in 2012 by two women with extensive experience in the semiconductor industry who believed passionately that materials cleaving and scribing should be easy and fast.   LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® scribeless cleaving system and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom. Learn more at http://www.latticegear.com/.

About Hong Kong Guanghong International Co., Ltd. (GHITC)
GHITC provides sales and service for nanotechnology-related equipment, supporting both semiconductor failure analysis and materials research applications from their headquarters in Shanghai. Their team includes experts in electron microscopy, as well as in the semiconductor industry. Within China, learn more at www.ghitcsh.com.

Contact:

Efrat Moyal, LatticeGear LLC
efrat.moyal@latticegear.com

Michael Heng, Hong Kong Guanghong International Co., Ltd
hongkongguanghong@163.com

22 May 2017

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

“NanoTechnology Solutions’ expertise in microscopy and sample preparation makes them the ideal partner to support our customers in ANZ,” said Efrat Moyal, Co-Founder of LatticeGear. “We are confident that engineers and scientists who want to add LatticeGear high accuracy scribing and cleaving techniques to their lab will get the same expert advice as if they had come to us directly.”

LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® Scribeless Cleaving System and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom.

NanoTechnology Solutions specializes in supply and service of microscopy and sample preparation instruments across Australia and New Zealand. They have extensive experience in high resolution imaging techniques such as Electron Microscopy and Scanning Probe Microscopy for both materials science and biological samples. They put their strong knowledge to work with training and expert advice on sample preparation and imaging – even for complex materials and challenging applications – to help researchers achieve desired results in their projects.

Contact information:
NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 

 

14 Feb 2017

LatticeAx Cleaving Tool In the Cleanroom at PennState Materials Research Institute

Did you know that you can use the LatticeAx indent and cleaving tool at the PennState Materials Research Institute? The LatticeAx 420 is located in the Nanofabrication Laboratory cleanroom. It has improved the success rates for preparing cleaved samples in comparison to manual techniques using handheld tools. The LatticeAx is simple to use and can cleanly downsize samples or prepare cross sections prior to SEM or other analysis. If you need to prepare samples free of particles in a cleanroom environment, Contact the nanofabrication facility at nanofab@psu.edu.

14 Nov 2016

High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

27 Oct 2016

LatticeGear Receives Business Certifications

LatticeGear, LLC. has been certified! The following certifications were granted:

  • Emerging Small Business (ESB)
  • Women Business Enterprise (WBE)
  • Minority Business Enterprise (MBE)

LatticeGear’s certification ID is 10516. Thanks much to the State of Oregon and Marta Tarantsey for coaching us through the certification process. Please contact us for copies of the certification letters.

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