16 Jan 2019

Downsizing Tempered Glass using the FlexScribe

Tempered glass cover for iPhone, downsized into 4 pieces.

I didn’t think it could be done but there are simple tools available to downsize tempered glass for quality control or failure analysis. With a custom scribing mechanism our FlexScribe can be used to downsize tempered glass for quality control or failure analysis. Read More….

16 Jan 2019

Live Demos at the Yale Applied Physics User Meeting

Yale’s School of Engineering and Applied Physics (SEAS) will host their Cleanroom User Meeting on January 22, 2019. Share your experience with users, and vendors in the field. Hear Efrat Moyal talk about “Cleaving Science” and learn how to use the best methods and tools to prepare samples for processing and characterization. Get the inside scoop by downloading LatticeGear’s article on cleaving in the cleanroom!

02 Nov 2018
22 Oct 2018

Are You Ready For ISTFA?

LatticeGear has you covered from all sides!

Booth 220, Phoenix Convention Center October 30-31

Sign up for Tools of the Trade to get a Preview of our new products including the

NEW FlexScribe topside scriber, it’s a MUST SEE (Monday October 29- 5-6pm)

The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and LatticeAx® scribing and cleaving solutions.

The FlexScribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.

 

17 Aug 2018

See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19

Sapphire wafer after cleaving into small samples

IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Fabricated Nanostructure after cleaving

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

07 Aug 2018
07 Aug 2018
27 Jun 2018

Dry, Particle-Free Wafer Downsizing in the Cleanroom

Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper.

First you may ask “Why implement a cleaving process in the cleanroom?”:

Here is what the Operations Director of a National Nanofabrication Facility had to say,

“Here at our nanofabrication facility, we found that after installing the micro-indent [LatticeAx 420] in our cleanroom, users are no longer cleaving samples in the lithography area. Additionally, the “cleaner” cleaving process of the micro-indent creates very few shards and particles that are easily vacuumed. Users are motivated by the capabilities of the LatticeAx and rewarded with a cleaner process. It’s a win-win scenario”

LatticeGear presents a process and data showing how the LatticeAx 420 scribeless cleaving system was used to cleanly cleave wafers. To obtain statistics, 60 samples were cleaved out of 10 whole, 4” silicon wafers. The results showed no increase in particle count.

Particle count comparison for 0.3 micron size, before and after wafer cleaving, points 1-3.

LatticeGear wishes to thank the University of Sydney (Ethel Cabrera Ilagan) and Penn State University for their assistance with this study.

Contact LatticeGear at lg@latticegear.com to get a copy of the paper.

05 Mar 2018

Cleaving with LatticeGear Cleanbreak Pliers

When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur!

LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to;

  • decide which type of jaws to install (there are two types)
  • install the cleaving jaws,
  • cleave a sample (glass and silicon) and
  • remove and replace jaws when they are worn out

For  small samples (<15 mm) use LatticeGear’s small sample cleaving pliers

Download the information card here.

Bare sapphire wafer during cleaving with the Cleanbreak pliers

20 Feb 2018

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