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Failure analysis (FA) on MEMS devices involves decapsulating the bonded
MEMS device. If the decapsulation is destructive and/or contaminating, it
will affect the analysis and lead to wrong conclusions consequently.
Therefore, it is of great importance to establish a reliable (with high
success rate and least damages/risks) approach for MEMS decapsulation.
Learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices cleanly and with high success rates.
|1500413209wpdm_A Controlled Method for MEMS Decapsulation.pdf||Download|