How to use LatticeGear Cleaving and Scribing Tools

LatticeAx 420 Cleaving Process

Use the LatticeAx to downsize substrates or making SEM ready cross sections with the. It accurately indents prior to cleaving for the highest accuracy sample preparation performance.

How to set the height and tilt of the FlipScribe Scriber

The FlipScribe is a scribing tool with a scriber that scribes the back of the sample. The diamond scriber, tilt and height are adjustable. This video shows how to adjust it.

Downsizing a whole wafer using handheld scribing and cleaving tools

Using tools from LatticeGear’s scribing and cleaving kits you can cleanly downsize a whole wafer. See how it is done.

Scribing at 45 degrees using the FlipScribe and Custom Holders

When the lithography is printed at 45 degrees to the crystal orientation (typical with memory) cleaving also needs to be performed at 45 degrees. See how it is done using a special holder and the FlipScribe.

Applications Videos

Scribing glass with the FlipScribe

Read more about the FlipScribe

Downsizing a silicon (111) wafer with the FlipScribe and 4″ holder

Read more about the FlipScribe

Cleaving a Hard Disk with the LatticeAx

Read more about the LatticeAx

Cleaving Samples into Narrow Strips

Read more about the FlipScribe and LatticeGear’s Small Sample Pliers

Delid of MEMS Device Using the LatticeAx

Read more about the LatticeAx 

Use of the LatticeAx 120 to Cleave Glass and Silicon

Read about how Penn State cleaves slides.

Accessories and Consumables

Changing the LatticeAx diamond indenter

Read more about LatticeAx consumables

Installing the Large Sample Platform

Read more about LatticeAx accessories

Other Interesting Videos

See how a wafer with (111) crystal orientation cleaves

© 2017 LatticeGear. All rights reserved.