How to use LatticeGear Cleaving and Scribing Tools

LatticeAx 420 Cleaving Process

How to set the height and tilt of the FlipScribe Scriber

Scribing at 45 degrees using the FlipScribe and Custom Holders

Loading a sample into the FlipScribe holder for small samples

Use the LatticeAx to downsize substrates or making SEM ready cross sections with the. It accurately indents prior to cleaving for the highest accuracy sample preparation performance.

The FlipScribe is a scribing tool with a scriber that scribes the back of the sample. The diamond scriber, tilt and height are adjustable. This video shows how to adjust it.

When the lithography is printed at 45 degrees to the crystal orientation (typical with memory) cleaving also needs to be performed at 45 degrees. See how it is done using a special holder and the FlipScribe.

Load and sample into the small sample holder and also see how to cleave it with the small sample pliers.

Downsizing a whole wafer using handheld scribing and cleaving tools


Using tools from LatticeGear’s scribing and cleaving kits you can cleanly downsize a whole wafer. See how it is done.

Applications Videos


Delid of MEMS Device Using the LatticeAx

Use of the LatticeAx 120 to Cleave Glass and Silicon

Cleaving a Hard Disk with the LatticeAx

Downsizing Samples Prior to Examination in A SEM With Height Restrictions

Read more about the LatticeAx 

Read about how Penn State cleaves slides.

Read more about the LatticeAx

Read more about the LatticeAx

Cleaving Thick and Thin Glass

Read more about the LatticeAx and the FlipScribe


Scribing glass with the FlipScribe

Downsizing a silicon (111) wafer with the FlipScribe and 4″ holder

Cleaving Samples into Narrow Strips

Use of FlipScribe Sample Holders to Cleave Small Samples

Read more about the FlipScribe

Read more about the FlipScribe

Read more about the FlipScribe and LatticeGear’s Small Sample Pliers

Read more about the FlipScribe and LatticeGear’s Small Sample Pliers and FlipScribe sample holders

Downsizing samples for SEM/AFM/Surface Analysis

Cleaving Die from a wafer with 111 orientation

Read more about the FlipScribe

Read more about the FlipScribe

Accessories and Consumables

Changing the LatticeAx diamond indenter

Installing the Large Sample Platform

Read more about LatticeAx consumables

Read more about LatticeAx accessories

Other Interesting Videos

See how a wafer with (111) crystal orientation cleaves

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