FlipScribe 100

Scribe Without Touching the Sample Surface

Fast Downsizing no Frontside Damage

Scribing Reinvented. The FlipScribe lets you view the front side of your sample and scribe the back side. The FlipScribe is a compact, stable, accurate, fast and low cost scribing and cleaving tool suitable for any lab; no utilities required. By integrating a robust, fixed diamond scribe into a sample platform with a fence guide design, scribing accuracy can be achieved without damaging the sample surface. Accommodates a wide variety of materials, for example: Sapphire, GaN, glass, SiC, etc. 



Scribing and breaking at 45 degrees

Scribing and breaking at 45 degrees

Currently sawing or polishing samples at 45 degrees? Use the FlipScribe to scribe and break these difficult samples. Call LatticeGear to hear more, 503-828-0040, lg@latticegear.com


  • Enables accurate cleaving through frontside targets with a scribe made on the backside of the substrate
  • Scribe does not damage the frontside of the sample
  • Accuracy of scribe ±200 μm (achievable)
  • Flexible with respect to sample size and shape
  • Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
  • No maintenance required


  • Accurate positioning of the scribe relative to features on the front side (the front side being observed either by eye or with a stereoscope).
  • The length of the scribe can be varied from 1 mm to 100 mm
  • Prealigned diamond scribe in user replaceable cartridge; height and angle adjustable
  • Ruler embedded in platform enables precise and repeatable sample alignment and sizing
  • The tool is purely mechanical; no power required
5 sample holder kit for FlipScribe
MC-FSWH45 Holder for 45 Degree Rotated Lithography.
MC-FSSS FlipScribe holder for small samples
MC-FSWH2 2" Round Wafer Holder
MC-FSWH3 3" Round Wafer Holder for FlipScribe
MC-FSWH4 4" Round Wafer Holder for FlipScribe
FlipScribe replacement cartridge
GC-SS-100 Small Sample Cleaving Pliers
CWBR-100 Cleanbreak Pliers

You will flip when you see this!

Questions? Send us a message and we will answer them and send you the  FlipScribe DataSheet:

We use the FlipScribe to quickly downsize our wafers for further processing in our fab. Relative to wafer dicing, the Flipscribe is a cost effective solution that reduces waste and improves turn-around-time.

R&D Engineer

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