DESCRIPTION
This package contains the consumables and tools to complete your wafer downsizing workflow area. Included with each LGAX-OPT1:
- Two Diamond Indenters: Spare standard indenters to decrease downtime
- CleanBreak™ Pliers: Cleaving pliers for samples down to 30 mm
- Pen Style Diamond Scribe: a retractable scriber in a sleek casing
- Straight Tip Diamond Scribe: a fine tipped scriber with a 4” hexagonal handle
- Angle Tip Diamond Scribe: a scriber with a 30° angled tip and a 6” hexagonal handle
- Large Cutting Mat: An 18x12 inch, double sided, self-healing mat with ruling lines
- Small Cutting Mat: A 3.5x5.5 inch, double sided, self-healing mat with ruling lines
- Tweezers: 6” length with nonmarring fine tips
- Rulers: Both with metric and imperial/US units – one flexible clear and one slim metal
- Cleaving Wire: Tungsten, for quick cleaves post scribe