Cleaving kit- without large mat

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This set contains the tools to scribe and cleave wafer samples from a variety of materials and substrates, including but not limited to glass, GaAs and Si. Included with each CSK-200-LG:

• CleanBreak™ Pliers: Cleaving pliers for samples down to 20 mm
• Pen Style Diamond Scribe: a retractable scriber in a sleek casing
• Straight Tip Diamond Scribe: a fine tipped scriber with a 4” hexagonal handle
• Angle Tip Diamond Scribe: a scriber with a 30° angled tip and a 6” hexagonal handle
• Small Cutting Mat: A 3.5x5.5 inch, double sided, self-healing mat with ruling lines
• Tweezers: 6” length with nonmarring fine tips
• Rulers: Both with metric and imperial/US units – one flexible clear and one slim metal
• Cleaving Wire: Tungsten, for quick cleaves post scribe