17 Aug 2018

See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19

Sapphire wafer after cleaving into small samples

IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Fabricated Nanostructure after cleaving

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

07 Aug 2018
22 May 2017

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

“NanoTechnology Solutions’ expertise in microscopy and sample preparation makes them the ideal partner to support our customers in ANZ,” said Efrat Moyal, Co-Founder of LatticeGear. “We are confident that engineers and scientists who want to add LatticeGear high accuracy scribing and cleaving techniques to their lab will get the same expert advice as if they had come to us directly.”

LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® Scribeless Cleaving System and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom.

NanoTechnology Solutions specializes in supply and service of microscopy and sample preparation instruments across Australia and New Zealand. They have extensive experience in high resolution imaging techniques such as Electron Microscopy and Scanning Probe Microscopy for both materials science and biological samples. They put their strong knowledge to work with training and expert advice on sample preparation and imaging – even for complex materials and challenging applications – to help researchers achieve desired results in their projects.

Contact information:
NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 

 

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

04 Oct 2016

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