27 Jun 2018

Dry, Particle-Free Wafer Downsizing in the Cleanroom

Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper.

First you may ask “Why implement a cleaving process in the cleanroom?”:

Here is what the Operations Director of a National Nanofabrication Facility had to say,

“Here at our nanofabrication facility, we found that after installing the micro-indent [LatticeAx 420] in our cleanroom, users are no longer cleaving samples in the lithography area. Additionally, the “cleaner” cleaving process of the micro-indent creates very few shards and particles that are easily vacuumed. Users are motivated by the capabilities of the LatticeAx and rewarded with a cleaner process. It’s a win-win scenario”

LatticeGear presents a process and data showing how the LatticeAx 420 scribeless cleaving system was used to cleanly cleave wafers. To obtain statistics, 60 samples were cleaved out of 10 whole, 4” silicon wafers. The results showed no increase in particle count.

Particle count comparison for 0.3 micron size, before and after wafer cleaving, points 1-3.

LatticeGear wishes to thank the University of Sydney (Ethel Cabrera Ilagan) and Penn State University for their assistance with this study.

Contact LatticeGear at lg@latticegear.com to get a copy of the paper.

06 Sep 2017

LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities

Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization.  This type of lecture is not part of any curriculum, yet fundamental for research and development.

It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material.  While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.

Please contact LatticeGear at lg@latticegear.com if you would like to schedule a seminar at your industrial or academic laboratory.

04 Apr 2017

Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures

Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research to investigate the quantum interactions between light and nanophotonic semiconductor materials. They needed a way to cleave small sample without damaging the delicate devices. Cleaving using hand held scribers and cleaving tools did not produce the quality needed but the LatticeAx 420 cleaving system was able to do the job.

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