14 Nov 2016

High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

16 Jun 2016

Downsizing die to fit your Prober or SEM or FIB sample holder

Downsize die to fit your Prober, SEM or FIB sample holder without any “cracking” risk

Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the cleaving step was eliminated.  For thicker samples (or die on a host), a 2 step process, microline indent + 3-point cleave is used. These processes enable hard to prepare thin and thick back end samples to be prepared.

n-probe stub

Out-of-package samples prepared using the LatticeAx. Bottom right shows sample on n-prober stub.

© 2017 LatticeGear. All rights reserved.