17 Aug 2018

See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19

Sapphire wafer after cleaving into small samples

IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Fabricated Nanostructure after cleaving

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

22 May 2017

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

“NanoTechnology Solutions’ expertise in microscopy and sample preparation makes them the ideal partner to support our customers in ANZ,” said Efrat Moyal, Co-Founder of LatticeGear. “We are confident that engineers and scientists who want to add LatticeGear high accuracy scribing and cleaving techniques to their lab will get the same expert advice as if they had come to us directly.”

LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® Scribeless Cleaving System and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom.

NanoTechnology Solutions specializes in supply and service of microscopy and sample preparation instruments across Australia and New Zealand. They have extensive experience in high resolution imaging techniques such as Electron Microscopy and Scanning Probe Microscopy for both materials science and biological samples. They put their strong knowledge to work with training and expert advice on sample preparation and imaging – even for complex materials and challenging applications – to help researchers achieve desired results in their projects.

Contact information:
NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 

 

04 Apr 2017

Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures

Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research to investigate the quantum interactions between light and nanophotonic semiconductor materials. They needed a way to cleave small sample without damaging the delicate devices. Cleaving using hand held scribers and cleaving tools did not produce the quality needed but the LatticeAx 420 cleaving system was able to do the job.

More..

14 Nov 2016

High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

31 Aug 2016

LatticeGear introduces the NEW LatticeAx 225

The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″).  The new design enables magnification and focus to be changed without mechanical adjustments to the microscopes working distance. The perfect, indent and cleaving system with microscope vision for downsizing wafers and a wide variety of samples for analysis or further processing. READ MORE

LatticeAx 225 right side view

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