LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.
Welcome to LatticeGear
LatticeGear has developed solutions for preparing the highest quality scribed and cleaved samples. Our smart mechanical solutions deliver samples with speed and simplicity at low startup cost and without service contracts. LatticeGear solutions enable you to get to the business of analysis faster.