04 Apr 2017

Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures

Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research to investigate the quantum interactions between light and nanophotonic semiconductor materials. They needed a way to cleave small sample without damaging the delicate devices. Cleaving using hand held scribers and cleaving tools did not produce the quality needed but the LatticeAx 420 cleaving system was able to do the job.


14 Nov 2016

High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

14 Nov 2016

LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016

LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin and out-of-package-die”. It was a good time to learn about best practices for sample preparation of electronic devices and to catch up with colleagues in the industry.

04 Oct 2016
20 Jun 2016
20 Jun 2016

Cleaving Photoresist

SEM image of Photoresist prepared with the LatticeAx

SEM image of Photoresist prepared with the LatticeAx

Photoresist, because it is soft, makes it difficult to cross section mechanically or with the FIB. The best solution is to cleave the sample and image it directly in the SEM. This makes the LatticeAx the perfect tool for sample preparation of photoresist cross sections. The resist structure is not changed in the process and the simple cleave is achieved in <5 minutes.

16 Jun 2016

Downsizing die to fit your Prober or SEM or FIB sample holder

Downsize die to fit your Prober, SEM or FIB sample holder without any “cracking” risk

Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the cleaving step was eliminated.  For thicker samples (or die on a host), a 2 step process, microline indent + 3-point cleave is used. These processes enable hard to prepare thin and thick back end samples to be prepared.

n-probe stub

Out-of-package samples prepared using the LatticeAx. Bottom right shows sample on n-prober stub.

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