The original die was depackaged, too thin to handle any other way, the die was attached to a host substrate. The LatticeAx was used to downsize the sample in preparation for further processing. The indent was created on the host substrate. No special process was used to indent and cleave the sample.
Welcome to LatticeGear
LatticeGear has developed solutions for preparing the highest quality scribed and cleaved samples. Our smart mechanical solutions deliver samples with speed and simplicity at low startup cost and without service contracts. LatticeGear solutions enable you to get to the business of analysis faster.