Semiconductor Use Cases

Semiconductor Publications

Publications (for copies, contact lg@latticegear.com) or for downloadable copies of these publications you must be registered and signed in

Download

Cleanroom Technology, Clean Cleaving

Download

Global Foundries, A Controlled Mechanical Method for MEMS Decapsulation (poster)

Download

University of Copenhagen, Successful Cleaving of Delicate Nanostructures

Download

ISTFA 2014, Conference Proceedings Advances in FIB-SEM Analysis of TSV and Solder Bumps - Approaching Higher Precision, Throughput and Comprehensiveness

Download

Solid State Technology, From Transistors to Bumps: Preparing SEM Cross-Sections by Combining Site-specific Cleaving and Broad Ion Beam Milling

Download

EDFA Journal, Cleaving Breakthrough: A New Method Removes Old Limitations

Advanced Materials Use Cases

Need Advice? We've got you covered.

Ask an expert and receive a free cleaving gift!

Ask An Expert

Semiconductor Use Cases

Downsizing and thin out of package die

Preparing samples for probing, SEM or FIB

Downsizing wafers with cleaving and scribing tools

Cleaving Copper Bumps

Cleaving Samples with Rotated Lithography

Preparing samples 1 mm wide

Fabricated Nanostructure after cleaving Fabricated Nanostructure after cleaving

4x3mm sample prepared using the LatticeAx

Cleaving electronic structures fabricated at 45 degrees to Silicon (100)

LatticeAx diamond indenter separating the MEMS device from the lid

Semiconductor Publications

Need Advice? We've got you covered.

Ask an expert and receive a free cleaving gift!