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Ted Pella, Inc. Acquires the Assets of LatticeGear, LLC.
June 28th, 2021: Lattice Gear, LLC announces that they have sold their product, manufacturing and associated assets to Ted Pella, Inc. Janet Teshima, the owner and cofounder of LatticeGear signed the agreement with Tom Pella, owner and president of Ted Pella, Inc., on June 23rd, 2021. LatticeGear, LLC will cease normal business operations on July 21st, at which time Ted Pella, Inc. will commence producing, selling and supporting the LatticeGear product line. .
Janet Teshima said, “I’ve enjoyed being part of a creative team, producing and selling a set of products that is unique in the world of cleaving for the Semiconductor market, as well for other applications. I’ve now found a company that will carry on in what we started, and wish them all the best”.
Tom Pella commented that, “We are honored that Janet Teshima has entrusted us with the ongoing production and sales of product from the LatticeGear portfolio. We feel that they complement several instruments and accessories we have that already serve Materials Science customers in general and the Semiconductor R&D / Failure Analysis / Photonics customers in particular. We shall continue the LatticeGear legacy of serving those market segments with innovative scribing and sample cleaving solutions.”
LatticeGear, LLC, based in Hillsboro, OR has served the needs of customers working in Semiconductors, Photonics and Materials Science since 2012.
Ted Pella, Inc. has served the needs of both the Life Science and Materials Science sample preparation for various microscopy communities for more than half a century.
Regarding this sale, please send inquiries for Ted Pella, Inc. to sales@tedpella.com, and for LatticeGear, LLC to janet.teshima@latticegear.com.
Expanded Product Offering from LatticeGear
LatticeGear has recently released the FlexScribe300 for scribing 300 mm wafer pre-cleave and CleanBreak 8” pliers for cleaving wafers of thick glass and hard materials, post scribe. For more information see LatticeGear Offers New Sizes to Old Favorites.
New Products for Scribing Glass and Silicon
LatticeGear has released a new line of Tungsten Carbide Scribers
LatticeGear announces a new line of Carbide Cutters for manually cleaving Glass and Silicon wafers. The Carbide Cutter line are hand tools with a tungsten carbide scribing wheel that will create a clean scribe on the glass or silicon wafer, facilitating an accurate cleave to downsize to a precise sample. The Carbide Cutter line includes a variety of wheel angles and widths, to accommodate a variety of material combinations and sample thicknesses. The new Carbide Cutter Cleaving Kit includes three of the Carbide Cutters and two sizes of CleanBreak™ Pliers and additional tools to complete the sample prep workspace.
For more information see the Carbide Cutter Guide and New Carbide Cutters.
MSE Supplies and LatticeGear partner to provide wafers and the tools to scribe and cleave them!
Live Scribing and Cleaving Demos with LatticeGear at the 2020 CNF Annual Meeting
Participants in the CNF Annual meeting on September 10, 2020 will have the opportunity to "visit" a number of virtual exhibits. LatticeGear will have available our full suite of indent, scribing and cleaving tools for demonstration. Register for the meeting and you will receive an invite to our Zoom demonstration booth. Registration is open now and there are no fees!
LatticeGear Joins Columbia University at the Frontiers of Nanoengineering!
Attendees and presenters at Columbia's Nano Day poster session get a firsthand look of clean, fast and dry cleaving. LatticeAx at the Frontiers of Engineering
Visit CleaveLandia at ISTFA 2019 Portland, Oregon
Try the LatticeAx, FlipScribe and FlexScribe for yourself. And while at our booth enjoy some Portland-themed fun!
October 29 LatticeGear Sponsors Columbia Nano Day at the Columbia University’s Research Initiative in NanoTechnology (CNI)
LatticeGear sponsors Columbia Nano Day at the Columbia University’s Research Initiative in NanoTechnology (CNI). LatticeGear will have its scribing and cleaving portfolio available for live demo during lunch time noon to 2pm, come and see the novel technologies. - https://cniindustryday2019.splashthat.com/
October 28 LatticeGear at Singh Center for Nanotechnology @ U PENN 2019 Annual User Meeting
LatticeGear sponsors Singh Center for Nanotechnology @ U PENN 2019 Annual User Meeting. LatticeGear will have its entire scribing and cleaving portfolio available for live demo. Come and see a paradigm shift in wafer downsizing, singulating and cross-section in the cleanroom - https://www.eventbrite.com/e/singh-center-for-nanotechnology-2019-annual-user-meeting-registration-70650414291
September 5 at MITnano
CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES
9:30am–10:30am
12-0168, MIT.nano (basement level), Building 12
60 Vassar Street (rear)
Cambridge, MA
Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room temperature method that maintains all the parts without altering the process layers. The challenge with standard cleaving is the control and repeatability over quality and accuracy outcome. Therefore, we often resort to alternative methods, like dicing saw and FIB milling. LatticeGear focuses its entire product portfolio on cleaving technologies that challenges one assumptions about cleaving and scribing capabilities. The patented scribeless cleaving technology initiates the cleave with only microline indentation, no scribing and no particles, which makes it cleanroom compatible. The unique, patented scribing tool scribes on the backside to protect frontside features, ideal for clean, surface touchless downsizing. These technologies coupled with correct planning of the substrate preparation workflow based on the substrate characteristics and the outcome required enable downsizing and cross-sectioning for a variety of materials including glass, sapphire, III-V, SiC and silicon, and 300-mm wafer to 1-mm die. It even cleaves freestanding structures deposited by e-beam lithography and <100-µm thin substrate.
Join the workshop and learn how to handle your substrates successfully.
For more information contact, efrat.moyal@latticegear.com
August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference
James Watt South (JWS) Building (Room 375)
PATENTED Backside Scribing - FlipScribe and PATENTED cleaving with no scribing – LatticeAx – Cleanroom compatible, will be demonstrated throughout the 2-days
We encourage you to bring your wafers and samples to try it out!
For more information contact, efrat.moyal@latticegear.com
August 21-22 at Molecular Foundry User Meeting , LBNL Berkeley, CA
Scribeless cleaving and backside scribing demos will be held during breaks and at the poster session, August 21, Building 54 Patio/cafeteria. LatticeGear is also happy to sponsor the session on Materials and Devices for Brain-Like Computing chaired by Alberto Salleo.
For more information contact, efrat.moyal@latticegear.com
Past Conferences
August 4-8 at Microscopy and Microanalysis, Portland, Oregon
See a demonstration of the LatticeAx 420 and the surface touchless scribing tool FlipScribe 100 at the Electron Microscopy Sciences booth 938.
For more information contact, efrat.moyal@latticegear.com
July 19 at Stanford Nanofabrication Facility, CA
Live demos on scribeless cleaving. Friday July 19, 2019 from 10am-Noon
For more information contact, efrat.moyal@latticegear.com
July 9-11 at Semicon West in San Francisco, California
See a demonstration of the SCRIBELESS LatticeAx 120 cleaving machine for 300-mm wafer down to a single die and the surface touchless scribing tool - FlipScribe 100 at the Electron Microscopy Sciences booth #5977
For more information contact, efrat.moyal@latticegear.com
July 2-5 at IPFA Failure Analysis Conference in Hangzhou, China
Please plan to visit us there to learn more about our Cleaving Technologies and attend a LIVE DEMO!
For more information contact, efrat.moyal@latticegear.com
June 28-July 1 at ICLPT Laser at Photonics Technologies Conference in Xian, China
June 17-18 at ENRIS 2019 in Enschede, the Netherlands
we will be exhibiting our cleanroom-compatibleLatticeAx 120 and FlipScribe 100
For more information contact, efrat.moyal@latticegear.com
LatticeGear to Exhibit at the 2019 TechConnect World Innovation Conference June 17-18
See the LatticeAx and FlipScribe patented technologies in the innovation showcase Booth #38
To obtain a free exhibit pass contact:
LatticeGear LLC
lg@latticegear.com
September 21, 2018 - LatticeGear to Present and Exhibit at ESREF October 2-4, 2018
Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.
See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23
LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here
Contact Information:
LatticeGear LLC
lg@latticegear.com
August 20, 2018 - IMC19 - 19th International Microscopy Congress Sydney, Australia September 9-14, 2018
Visit LatticeGear- Booth 86 (Nano Technology Solutions)
At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon.. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.
Contact Information:
LatticeGear LLC
lg@latticegear.com
August 17, 2018 - JSAP 2108, September 18-21, 2018, Nagoya Japan
Visit LatticeGear at Hisol booth
Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.
DO NOT MISS, LatticeGear Luncheon Seminar: The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.
Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE
Contact Information:
LatticeGear LLC
lg@latticegear.com
June 27, 2017 - LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research
LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.
Contact Information:
LatticeGear LLC
lg@latticegear.com
Michael Heng, Hong Kong Guanghong International Co., Ltd
hongkongguanghong@163.com
May 22, 2017 - LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand
LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).
Contact information:
NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au
LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com
